Thermal Paste AG Copper – professional paste for copper radiators (3.1 W/mK)

Thermal Paste AG Copper is a modern solution for anyone looking to enhance the cooling efficiency of their computer. Designed to meet the high demands of professionals and technology enthusiasts, our copper-based paste offers more than just standard cooling with its 3.1 W/mK thermal conductivity. It is a technologically advanced product that will transform your equipment, ensuring maximum performance with copper radiators.

Product Features

• High Thermal Conductivity: Thermal Paste AG Copper is enriched with copper compounds, providing a thermal conductivity of ~3.1 W/mK. This effectively dissipates heat, which is crucial for the optimal performance of your equipment. The copper color of the paste visually highlights its advanced technology.
• Versatile Application: Ideal for filling micro-inequalities between contacting elements, such as the processor and radiator. It also performs excellently in cooling power systems like converters, motor controllers, and power amplifiers. Its universal application makes it indispensable in computers and advanced electronic systems.
• Thermal Stability: Thermal Paste AG Copper minimizes thermal resistance, resulting in better cooling and extended lifespan of electronic components. It operates effectively over a wide temperature range from -50°C to 250°C, and temporarily up to 340°C. It is perfect for applications requiring high reliability in extreme conditions.
• Physicochemical Properties: AG Copper has a density of ~2.9 g/cm³ at 20°C and does not evaporate, ensuring long-lasting effectiveness. Its viscosity prevents it from flowing, and a thixotropic index of 380 ± 10 allows for easy application.
• Excellent Dielectric Properties: The specific cross-resistance is 3.8 x 10¹⁴ Ohm x cm, providing excellent electrical insulation. The dielectric loss factor tg δ at f=120 Hz is 0.013, and the relative dielectric constant εr at f=120 Hz is 13.6, further emphasizing its advanced dielectric properties.

Thermal Paste AG Copper – advantages of use

Thanks to the use of copper compounds, AG Copper provides efficient heat dissipation (~3.1 W/mK), which is crucial for maintaining optimal operating temperatures of electronic devices. Copper, with a thermal conductivity of about 370 W/mK, significantly surpasses aluminum, which has a thermal conductivity of about 200 W/mK. Thus, Thermal Paste AG Copper, combined with copper radiators, ensures even better cooling and performance of the equipment.

However, we do not recommend using copper-based paste with aluminum radiators. Copper can react with aluminum, leading to galvanic corrosion. Therefore, if you plan to use thermal paste in combination with aluminum cooling, we recommend choosing one of our Extreme, Gold, or Silver Thermal Pastes.

Thermal Paste AG Copper – available variants

Thermal Paste AG Copper is available in various capacities to meet the needs of both home users and professionals. Below is a complete list of available variants to help you choose the option that best suits your needs:

• 1.5 ml syringe (ART.AGT-060) – Ideal for precise applications and easy application.
• 14 ml syringe (ART.AGT-061) – A practical solution for precise application.

But that’s not all! Why collaborate with us?

Every customer is unique to us. If you run a business under your own brand, we will help you expand your range with our products. These products are perfectly tailored to your market.  Planning to enter foreign markets? This is definitely a great idea! Our specialty is creating Safety Data Sheets in 22 languages, allowing you to expand globally. Discover the full range of our support on the services page.

Summary

Thermal Paste AG Copper is a reliable solution for anyone expecting the highest cooling quality. Thanks to its advanced formula with copper additives, it provides not only exceptional thermal conductivity but also durability and safety. Choose AG Copper and see how much your equipment can benefit!

More information about the product can be found in the technical data sheet and safety data sheet.