Two-component silicone potting compound 011
Brands
- Electronics
- Electrotechnics
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The product is a liquid encapsulating compound, two-component. Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch.
Metal box 100g
| Properties | Value |
|---|---|
| Capacity | 100g |
| Package | Metal box |
| Number of pcs in the package | 4 |
| Product code | ART.AGT-219 |
| Bar code | 5901764325130 |
Metal box 1kg
| Properties | Value |
|---|---|
| Capacity | 1kg |
| Package | Metal box |
| Number of pcs in the package | 1 |
| Product code | ART.AGT-260 |
| Bar code | 5901764325574 |
| Capacity | Package | Number of pcs in the package | Art. code | Bar code | |
|---|---|---|---|---|---|
 | 100g | Metal box | 4 | ART.AGT-219 | 5901764325130 |
 | 1kg | Metal box | 1 | ART.AGT-260 | 5901764325574 |
