Silicone Potting Compound 011

Brands:

  • Electronics
  • Electrotechnics
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Silicone Potting Compound 011 – Reliable Protection for Your Electronic Systems

 

Silicone Potting Compound 011 is a modern, two-component material based on a condensation curing system, specifically designed for encapsulating and protecting electronic components. With its transparent formula and excellent flow properties, this product is perfect for filling gaps, even in the most complex enclosures. Potting Compound 011 provides reliable protection against moisture, dust, and extreme thermal conditions, while maintaining excellent dielectric properties.

 

Silicone Potting Compound 011 – Versatile Applications

Our Silicone Potting Compound 011 is the ideal solution for a wide range of applications in both the electronics and electrotechnical industries. Due to its outstanding physical and chemical properties, this product is widely used for encapsulating electronic and electrical systems, energy converters, and power semiconductors. It is also applied in power supplies, automotive electronics, motion control systems, telecommunications, computers, and peripheral devices

One of the key applications of Potting Compound 011 is the protection of electronic components from moisture, dust, and other external factors, significantly extending their lifespan. The product is perfect for filling gaps in electronic components with metal enclosures. It ensures complete hermetic sealing and provides protection against mechanical damage.

 

Silicone Potting Compound 011 – Application Process

Silicone Potting Compound 011 is incredibly easy to use, making it suitable for both professionals and less experienced users. Its pre-cure viscosity of 2000 ± 500 cP ensures easy dispensing and even distribution across surfaces. The product cures at room temperature, making the application process quick and convenient, but it requires adherence to a few critical steps.

  • Surface Preparation:
    Before beginning the potting process, the electronic system should be thoroughly cleaned, degreased, and dried. This is a crucial step to ensure optimal adhesion and effective protection.
  • Mixing Components:
    The compound consists of two parts – the silicone base and a catalyst, which must be mixed thoroughly in the correct proportions. Mixing can be done manually or mechanically, depending on the batch size, to achieve a homogeneous composition.
  • Air Removal:
    To avoid air bubbles, it is recommended to degas the mixture using a vacuum chamber. This ensures that the material, once cured, is uniform and free from unwanted voids, improving its mechanical and thermal properties.
  • Application and Curing:
    Once the mixture is prepared, the compound should be precisely applied to the system. It is crucial to leave the system open after application to allow the release of condensation by-products, such as ethanol. Curing at room temperature takes approximately 100 hours.

 

Reliability Confirmed by Specifications

Silicone Potting Compound 011 meets the highest technical requirements, making it the perfect choice for advanced industrial applications:

  • Volume resistivity: 1×10¹² Ω·cm (ASTM D257)
  • Surface resistivity: 1×10¹³ Ω (ASTM D257)
  • Dielectric constant: εr of 3 at 10⁶ Hz (ASTM D150)
  • Dielectric strength: 10 kV/mm (PN-EN 60243-1)
  • Comparative Tracking Index (CTI): 600 V (PN-EN 60112:2003)
  • Shore A hardness:25
  • Operating temperature range: -50°C to 200°C

 

These parameters ensure that Potting Compound 011 provides excellent electrical insulation. It also offers protection against overvoltage and short circuits, which is crucial in high-voltage applications.

 

Silicone Potting Compound 011 – Available Capacities

The compound is available in two variants:

  • 100 g (ART.AGT-219) – ideal for smaller projects and hobbyist applications.
  • 1 kg (ART.AGT-260) – suitable for industrial applications and mass production.

 

Produce Under Your Own Brand and Enjoy Additional Services

Would you like our potting compound to be available under your logo? We offer private label production and additional services such as creating safety data sheets in 22 languages. We are flexible and can adapt to your needs, providing full support at every stage of collaboration. Click here to explore our services.

 

Why Choose Silicone Potting Compound 011?

Potting Compound 011 is a reliable solution for protecting electronic systems, offering excellent hermetic sealing and resistance to extreme environmental conditions. With its transparent formula, the product maintains the aesthetic appearance of protected components. The flexible rubber it transforms into after curing guarantees long-lasting protection against moisture, dust, and mechanical damage.

 

For more information about the product, you can find the technical data sheet. The safety data sheet of the potting compound and catalyst are also available.

Zalewa Silikonowa 011, Opakowanie 100g - dwuskładnikowy materiał do hermetyzacji i ochrony układów elektronicznych, z doskonałą przewodnością ciepła i transparentnością. (Silicone potting compound 011, Silikon-Vergussmasse 011, Заливочная силиконовая масса 011) Metal box 100 g
PropertiesValue
Capacity100 g
PackageMetal box
Number of pcs in the package4
Product codeART.AGT-219
Bar code5901764325130
Zalewa Silikonowa 011, Opakowanie 1kg - dwuskładnikowy materiał do hermetyzacji i ochrony układów elektronicznych, z doskonałą przewodnością ciepła i transparentnością. (Silicone potting compound 011, Silikon-Vergussmasse 011, Заливочная силиконовая масса 011) Metal box 1 kg
PropertiesValue
Capacity1 kg
PackageMetal box
Number of pcs in the package1
Product codeART.AGT-260
Bar code5901764325574
CapacityPackageNumber of pcs in the packageArt. codeBar code
Zalewa Silikonowa 011, Opakowanie 100g - dwuskładnikowy materiał do hermetyzacji i ochrony układów elektronicznych, z doskonałą przewodnością ciepła i transparentnością. (Silicone potting compound 011, Silikon-Vergussmasse 011, Заливочная силиконовая масса 011)100 gMetal box4ART.AGT-2195901764325130
Zalewa Silikonowa 011, Opakowanie 1kg - dwuskładnikowy materiał do hermetyzacji i ochrony układów elektronicznych, z doskonałą przewodnością ciepła i transparentnością. (Silicone potting compound 011, Silikon-Vergussmasse 011, Заливочная силиконовая масса 011)1 kgMetal box1ART.AGT-2605901764325574
Zalewa Silikonowa 011, Opakowanie 100g - dwuskładnikowy materiał do hermetyzacji i ochrony układów elektronicznych, z doskonałą przewodnością ciepła i transparentnością.

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