Thermal conductive paste is a key element in ensuring optimal heat dissipation in various applications. Industrial thermal conductive pastes are widely used in power modules, motor control systems, cooling devices, and many other electronic components. Among silicone-based pastes, the H series stands out, including models: H, H2, H3, HP, and HPX. Each of them has slightly different properties tailored to specific industrial needs. However, all pastes in this series share the following characteristics:
- Resistance to acids, alkalis, salts, sulfur dioxide, and ammonia
- Excellent dielectric properties
- Versatile applications
Industrial Thermal Conductive Pastes – Characteristics and Comparison of H, H2, H3, HP, and HPX
The table below presents the key parameters of these pastes:
| Feature | H | H2 | H3 | HP | HPX |
|---|---|---|---|---|---|
| Color | White | White | White | White | Gray |
| Density (g/cm³) | ~2.58 | ~2.7 | ~1.37 | ~2.1 | ~2.0 |
| Thermal conductivity (W/mK) | >0.88 | >0.88 | >0.88 | >1.5 | >2.8 |
| Temperature range (°C) | -50 to 250 | -50 to 250 | -50 to 250 | -50 to 250 | -50 to 250 |
| Thermal impedance (°C in²/W) | – | – | – | <0.227 | <0.095 |
| Evaporation | – | – | – | 0.00% | 0.00% |
| Thixotropic index | – | – | – | 380±10 | 380±10 |
| Electrical resistance (Ohm × cm) | 3.7×10¹⁵ | 4.7×10¹⁵ | 1.0×10¹⁶ | 1.3×10¹⁴ | 1.4×10¹⁵ |
| Application methods | Machine, stencil, sachet, syringe, tube, cartridge gun | Machine, stencil, cartridge gun | Machine, stencil, cartridge gun | Machine, stencil, spatula, tube, cartridge gun | Machine, stencil, spatula, tube, cartridge gun |
| Packaging options | Sachets, syringes, tubes, plastic containers, buckets | Cartridges and buckets | Cartridges | Tubes, cartridges, plastic containers | Tubes, cartridges, plastic containers |
Comparison of Density and Thermal Conductivity of H, H2, H3 vs. HP and HPX
The density of a thermal paste affects its application method and heat conduction efficiency. H2 has the highest density (~2.7 g/cm³), making it more challenging to spread in some applications. H has a slightly lower density (~2.58 g/cm³), making it more versatile. H3 has the lowest density (~1.37 g/cm³), making it the lightest. It is also the easiest to distribute on irregular surfaces.
In terms of thermal conductivity, H, H2, and H3 pastes provide values above 0.88 W/mK, making them suitable for standard cooling applications in the electronics industry. Meanwhile, HP and HPX offer significantly higher thermal conductivity—HP exceeds 1.5 W/mK, while HPX reaches over 2.8 W/mK. This means HP and HPX are more efficient in dissipating heat in high-performance cooling applications, such as high-power electronic systems or power components with substantial heat generation.
Industrial Thermal Conductive Pastes – Applications
Silicone-based thermal conductive pastes from the H series are widely used across various industries. The most common applications include:
- High thermal conductivity modules – to dissipate heat from high-performance electronic components
- Cooling devices for end plates and frames
- Mass storage drives – HDD, SSD, and DVD, where reliable heat dissipation is crucial
- Power converters, electronic and electrical components – ensuring operational stability
- High-power LEDs – for optimal thermal management
- Consumer electronics and household appliances, air conditioners – applied in cooling systems and controllers
Conclusion
Silicone-based thermal conductive pastes from the H series offer a wide range of solutions, from cost-effective options to high-thermal-conductivity products. H2 and H3 are ideal for standard applications where affordability is key. On the other hand, HP and HPX are excellent choices for demanding cooling systems.
Thanks to their chemical resistance and dielectric properties, thermal pastes are reliable for electronics, automotive, and energy industries. Silicone-based pastes offer a great price-to-performance ratio, making them ideal for companies needing efficient and cost-effective cooling. The choice of paste depends on application and budget, but all H series products ensure effective and lasting heat dissipation.
In addition to standard thermal conductive pastes, our product range also includes high-thermal-conductivity pastes (3.57 – 6 W/mK), ideal for users demanding maximum cooling performance. We also offer thermal conductive adhesive (1.0 W/mK), ensuring a strong and lasting bond between components.
